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Agilent HSDL-9000 Miniature Surface-Mount Ambient Light Photo Sensor
Data Sheet
Description The HSDL-9000 is a low cost, digital-output ambient light photo sensor in miniature industry-standard PLCC leadfree surface-mount package. It incorporates a photodiode, which peaks in human luminosity curve at 550 nm. Hence, it provides an excellent responsivity that is close to the response of human eyes, as shown in Figure 2.
With the options of three digital levels and an analog Gain Control pin to fine tune the three threshold levels to achieve better sensitivity control, the HSDL-9000 is ideal for applications in which the measurement of ambient light is used to control display backlighting. Mobile appliances such as mobile phones and PDAs that draw heavy current from the display backlighting will benefit from incorporating the HSDL-9000 in their designs to reduce the power consumption significantly.
Features * Excellent responsivity which peaks in the human luminosity curve at 550 nm Close responsivity to the human eye * Miniature PLCC surface-mount package Height - 1.1 mm Width - 4.0 mm Depth - 3.2 mm * Ease of design with digital output Integrated photodiode and analog to digital output circuitry * Enable fine control of the backlight intensity with adjustable sensitivity control 3 digital levels An Analog Gain Control * Minimum power consumption 30 A typical idle (standby) current <10 nA typical shutdown current * Guaranteed temperature performance -25C to 85C * 2.7 - VCC - 3.6 V * Lead-free package * Low cost Applications * Detection of ambient light to control display backlighting Mobile devices - mobile phones, PDAs Automotive - dashboard Consumer appliances - audio sets * Daylight and artificial light exposed devices
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Ordering Information Part Number HSDL-9000 Packaging Type Tape and Reel Package 6-lead PLCC with Top Transparent Epoxy Surface Quantity 1500
Application Circuit For HSDL-9000 Ambient Light Photo Sensor
VCC
C1
(1) VCC
R1
(5)
AGain
ANALOG TO DIGITAL CIRCUITRY
DOUT (6)
HSDL-9000
GND
(4)
A0
(2)
A1
(3)
Figure 1. Functional block diagram of HSDL-9000.
I/O Pins Configuration Table Pin 1 2 3 4 5 6 Symbol VCC A0 A1 GND AGain DOUT I/O I I I I I O Description Supply Voltage Digital Gain Level Control_0 Digital Gain Level Control_1 Ground Analog Gain Constant Control Digital Output Notes Regulated, 2.7 to 3.6 Volt This pin needs to be driven high or low and not left floating. This pin needs to be driven high or low and not left floating. Connect to System Ground If not used, leave this pin unconnected. Tri-State[1]
Note: 1. The HSDL-9000 is in tri-state when it is in shut down mode.
I/O Truth Table[2] Logic Level A1 0 1 0 1 A0 0 0 1 1 Description High Gain Medium Gain Low Gain Shut down Incidence Light Threshold (Lux)[3] 30 81 164 -
Notes: 2. AGain pin is left floating. 3. Measurements are carried out using incandescent light source.
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Recommended Application Circuit Components Component C1 Recommended Value 1.0 F 20%, Tantalum
Recommended R1 Values[4] Incidence Light Threshold (Lux) R1 220 kW 5%, 0.25 W 430 kW 5%, 0.25 W 910 kW 5%, 0.25 W High Gain 23 25 28 Medium Gain 50 63 71 Low Gain 81 108 133
Note: 4. Measurements are carried out using incandescent light source.
1.1 1.0 0.9
NORMALIZED RESPONSIVITY
0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 350 450 550 650 750 850 950 1050
HSDL-9000
SILICON
EYE
WAVELENGTH - nm
Figure 2. Relative spectral responsivity vs. wavelength.
Caution: The BiCMOS inherent to this design of this component increases the component's susceptibility to damage from Electrostatic Discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation, which may be induced by the ESD.
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Absolute Maximum Ratings For implementations where case to ambient thermal resistance is - 50C/W Parameter Storage Temperature Operating Temperature Supply Voltage Output Voltage: RxD Symbol TS TA VCC VO Min. -25 -25 0 -0.5 Max. +85 +85 6 6 Units C C V V Conditions
Recommended Operating Conditions Parameter Operating Temperature Supply Voltage Logic Input Logic High Logic Low Symbol TA VCC VIH VIL Min. -25 2.7 VCC - 0.2 0 Max. +85 3.6 VCC 0.2 Units C V V V Conditions
Electrical & Optical Specifications Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25C with VCC at 3.0 V unless otherwise noted. Parameter Peak Sensitivity Wavelength Viewing Angle Logic Input Logic High Logic Low Output Voltage Logic High Logic Low Supply Current Shutdown Current VIH VIL VOH VOL ICC ICC (SD) VCC -0.2 0 VCC -0.2 0 33 10 Symbol lP Min. Typ. 550 120 VCC 0.2 VCC 0.2 100 100 Max. Units nm V V V V A nA IOH = -200 A IOL = 200 A Conditions
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HSDL-9000 Package Outline
4 0.2
1.1 0.2 0.15 MAX. 0.55 0.1
1.27 0.1
6 5
1.27 0.1
4
3.2 0.2
3.5 0.2
1
0.15 MAX.
2
3
0.8 0.3
0.4
SEATING PLANE
C
0.1 C
PIN 1. 2. 3. 4. 5. 6.
0.4 0.1
SYMBOL VCC A0 A1 GND AGain DOUT
Figure 3. Package outline dimensions.
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Tape and Reel Dimensions
UNIT: mm
4.0 0.1
1.75 0.1
AE 1.5 +0 1
2.0 0.05
POLARITY
5.5 0.05
PIN 1: VCC PIN 4: GND
4.22 0.1
12.0 +0.3-0.1
0.304 0.02
1.25 0.1
3.61 0.1
8.0 0.1
AE 1.5 +0.25
PROGRESSIVE DIRECTION
EMPTY (40 mm MIN.)
PARTS MOUNTED
LEADER (400 mm MIN.) EMPTY (40 mm MIN.)
UNIT: mm
DETAIL A
180 0.5
2.0 0.5
+0 62.5 -2.5
AE 13.0 0.2
R 1.0 LABEL
24 0.5
DETAIL A
18.4 MAX.
12.4 +2 -0
Figure 4. Tape and reel dimensions.
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Moisture Proof Packaging All HSDL-9000 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 4.
Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package In reels In bulk Temp. 60C 125C Time 20 hours 5 hours
Baking should only be done once.
UNITS IN A SEALED MOISTURE-PROOF PACKAGE
Recommended Storage Conditions Storage Temperature Relative Humidity 10C to 30C below 60% RH
PACKAGE IS OPENED (UNSEALED)
ENVIRONMENT LESS THAN 30 C, AND LESS THAN 60% RH
YES
Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions. If times longer than three days are needed, the parts must be stored in a dry box.
NO BAKING IS NECESSARY
YES
PACKAGE IS OPENED LESS THAN 72 HOURS
NO
PERFORM RECOMMENDED BAKING CONDITIONS
NO
Figure 5. Baking conditions chart.
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Reflow Profile
245 230 220 200 180 160 120 80 25 0 P1 HEAT UP
Figure 6. Reflow graph.
MAX 250C R3 R4
T - TEMP ERATURE (C)
R2
60 s e c MAX Ab o ve 217 C
R1
R5
50
100 P2 S OLDER P AS TE DRY
150
200 P3 S OLDER REFLOW
250 P4 COOL DOWN
300 t-TIME (S ECONDS )
Process Heat Up Solder Paste Dry Solder Reflow Cool Down
Symbol P1, R1 P2, R2 P3, R3 P3, R4 P4, R5
T 25C to 160C 160C to 200C 200C to 245C (250C max.) 245C to 200C 200C to 25C
Maximum T/time 4C/s 0.5C/s 4C/s -6C/s -6C/s
The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different T/time temperature change rates. The T/time rates detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and I/O pins are heated to a temperature of 160C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4C per second to allow for even heating of both the PC board and HSDL-9000 I/O pins.
Process zone P2 should be of sufficient time duration (60 to -120 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200C (392F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 245C (473F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 60 seconds. It usually takes about 20 seconds to assure proper coalescence of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 60 seconds, the intermetallic
growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200C (392F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25C (77F) should not exceed -6C per second maximum. This limitation is necessary to allow the PC board and transceiver's castellation I/O pins to change dimensions evenly, putting minimal stresses on the HSDL-9000.
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Appendix A : SMT Assembly Application Note 1.0 Solder Pad, Mask and Metal Stencil Aperture
METAL STENCIL FOR SOLDER PASTE PRINTING
STENCIL APERTURE
LAND PATTERN
SOLDER MASK
PCBA
Figure 7. Stencil and PCBA.
1.1 Recommended Land Pattern
4.7 1.5
0.6
1.27 3.14 C L
MOUNTING CENTER C L
UNITS: mm
Figure 8. Stencil and PCBA.
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1.2 Recommended Metal Solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inches) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. Aperture opening for shield pad is 1.5 mm x 0.6 mm as per land pattern.
APERTURES AS PER LAND DIMENSION
0.152
4.7
3.14
Figure 9. Solder stencil aperture.
1.3 Adjacent Land Keepout and Solder Mask Areas Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. Note: Wet/Liquid PhotoImageable solder resist/mask is recommended.
5.1
0.2 MIN. C L
4.8 SOLDER MASK
UNITS: mm
C L
Figure 10. Adjacent land keepout and solder mask areas.
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Appendix B: PCB Layout Suggestion The following PCB layout shows a recommended layout that should result in good electrical and EMI performance. Things to note: 1. The ground plane should be continuous under the part, but should not extend under the shield trace. 2. The shield trace is a wide, low inductance trace back to the system ground.
3. C1 and C2 are optional VCC filter capacitors. They may be left out if the VCC is clean. A reference layout of a 2layer Agilent evaluation board for HSDL-9000 based on the guidelines stated above is shown below. For more details, please refer to Agilent Application Note 1114, Infrared Transceiver PC Board Layout for Noise Immunity.
TopLayer
BottomLayer
Figure 11. PCB layout suggestions.
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Appendix C: Optical Window Design for HSDL-9000 Optical Window Dimensions To ensure that the performance of the HSDL-9000 will not be affected by improper window design, there are some con-straints on the dimensions and design of the window. There is a constraint on the minimum size of the window, which is placed in front of the photodiode, so that it will not affect the angular response of the HSDL9000. This minimum dimension that is recommended will ensure at least a 35 light reception cone. If a smaller window is required, a light pipe or light guide can be used. A light pipe or light guide is a cylindrical piece of transparent plastic which makes use of total internal reflection to focus the light. The thickness of the window should be kept as minimum as possible because there is a loss of power in every optical window of about 8% due to reflection (4% on each side) and an additional loss of energy in the plastic material. Figure 12 illustrates the two types of window that we have recommended which could either be a flat window or a flat window with light pipe.
Window
Detector
Flat Window
Flat Window with Light Pipe
Figure 12. Recommended window design.
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The table and figure below show the recommended dimensions of the window. These dimension values are based on a window thickness of 1.0 mm with a refractive index 1.585.
D1 TOP VIEW
T
WD L
D2
D1
Z HSDL-9000 Photodiode
Figure 13. Recommended window dimensions.
WD: 9000 D1: T: L: D2: Z:
Working Distance between window front panel & HSDLWindow Diameter Thickness Length of Light Pipe Light Pipe Diameter Distance between window rear panel and HSDL-9000
Table 4. Recommended Dimension for Optical Window WD (T+L+Z) 1.5 2.0 2.5 3.0 Flat Window (L = 0.0) Z 0.5 1.0 1.5 5.00 D1 2.25 3.25 4.25 5.00 Flat Window with Light Pipe (D2 = 1.5; z = 0.5) D1 - - - 2.5 L - - - 1.5
All Dimensions are in mm.
The window should be placed directly on top of the photodiode to achieve better performance and if a flat window with a light pipe is used, dimension D2 should be 13
1.5 mm (same size as the PIN) to optimize the performance of HSDL-9000. Please refer to Figure 14 for the top view of the placement of the window.
1.5
1.17 D2 PIN D1
Optical Window Material The material of the window is recommended to be polycarbonate. The surface finish of the plastic should be smooth, without any texture.
The recommended plastic material for use as a window is available from Bayer AG and Bayer Antwerp N. V. (Europe), Bayer Corp.(USA) and Bayer Polymers Co., Ltd. (Thailand).
WINDOW
Table 5. Recommended Plastic Material Material Number Makrolon LQ2647 Makrolon LQ3147 Makrolon LQ3187 Visible Light Transmission 87% 87% 85% Refractive Index 1.587 1.587 1.587
HSDL-9000
Figure 14. Placement of the window.
www.agilent.com/semiconductors
For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6756 2394 India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/International), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989 Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843 Data subject to change. Copyright (c) 2003 Agilent Technologies, Inc. 26 August, 2003 5989-0023EN

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